Space Products Division Manager
David started his career with Xerox in 1984 as a service technician. Using his technical and mechanical skills he moved up through the service sector and ultimately into engineering. Being self-taught in PWA layout and design along with VHDL, David designed video controller boards for image processing in high volume printers. Under a Senior engineer he was exposed to electromagnetic compliance work and fell in love with electromagnetic waves and fields. He eventually was the lead EMC engineer for several of Xerox’s high-volume printers. While working full time he obtained his BSEE in wireless communication and then a MSEE in high efficiency HPA designs for wireless communication applications from University of Rochester.
In 2008 David accepted a RF/Microwave Engineer position with Raytheon Missile Systems working under senior fellow Steve Huettner. David work with GaN HPAs for high-frequency Radar and transmitter designs including load and source pull testing. Additionally, he contributed innovative filters designs for compact LTCC filters in which he is the major contributor to a Raytheon Missile System patent. In support of LTCC filter designs he wrote Python scrip to auto generate parameterized HFSS models from filter synthesis tools. He is also named on two IPs for his work with meta-materials using FDTD methods.
David’s career took him to Nuvotronics in 2011 were he expended his innovation in 3D designs using PolyStrata™. His designs include time-delay transmission line structures, combiners/splitters, and cavity filters. David developed unique probing techniques for these complex 3D structures having interfaces as small as 50 microns square on multiple sides and frequencies up to 110 GHz.
In 2015 David transitioned to Viasat designing transceiver modules for Satellite communication systems. David greatly simplified the die-in-module wire-bonding process by designing a common set of wire-bond parameters to be used in all locations verses each location having a unique set. This improved production throughput and reduced human error. He also developed RF/Microwave probing techniques to obtained calibrated measurements within modules including die performance when installed in the flight module. This significantly reduced the time and ambiguity in diagnosing root causes for module performance issues.